US Patent Issued to Adeia Semiconductor Bonding Technologies on Jan. 20 for "Hotspot mitigation in fluid cooling" (California, North Carolina Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,432, issued on Jan. 20, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Hotspot mitigation in fluid cooling" was invented by Ron Zhang (Sunnyvale, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.), Thomas Workman (San Jose, Calif.) and Belgacem Haba (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device. The cold plate comprises a top portion, sidewalls and a divider extending downwardly from the top portion to a backside of the semiconductor device, an inlet opening; and an ...