US Patent Issued to Adeia Semiconductor Bonding Technologies on Jan. 13 for "Embedded cooling systems for advanced device packaging and methods of manufacturing the same" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,506, issued on Jan. 13, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Embedded cooling systems for advanced device packaging and methods of manufacturing the same" was invented by Belgacem Haba (Saratoga, Calif.), Ron Zhang (Sunnyvale, Calif.), Kyong-Mo Bang (Fremont, Calif.) and Suhail Jaan Sadiq (Dublin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package comprising an integrated cooling assembly comprising a semiconductor stack and a cooling channel, wherein the semiconductor stack comprises a first semiconductor device and a second semiconductor device stacked vertically above the first sem...