US Patent Issued to Adeia Semiconductor Bonding Technologies on Jan. 13 for "Direct bonding and debonding of carrier" (California, North Carolina Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,572, issued on Jan. 13, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Direct bonding and debonding of carrier" was invented by Guilian Gao (San Jose, Calif.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a semiconductor element is disclosed. The method can include providing the semiconductor element that has a first nonconductive material. The first nonconductive material is disposed on a device portion of the semiconductor element. The method can include providing a transparent carrier. The method can include providing an intervening struc...