US Patent Issued to Adeia Semiconductor Bonding Technologies on Feb. 4 for "Electrical redundancy for bonded structures" (California Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,107, issued on Feb. 4, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Electrical redundancy for bonded structures" was invented by Rajesh Katkar (Milpitas, Calif.) and Belgacem Haba (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element that is configured to bond to another element is disclosed. A first element that can include a first plurality of contact pads on a first surface. The first plurality of contact pads includes a first contact pad and a second contact pad that are spaced apart from one another. The first and second contact pads are electrically connected to one another for redunda...