US Patent Issued to Adeia Semiconductor Bonding Technologies on Feb. 3 for "Thermoelectric cooling for die packages" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,568, issued on Feb. 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Thermoelectric cooling for die packages" was invented by Belgacem Haba (Saratoga, Calif.), Rajesh Katkar (Milpitas, Calif.), Patrick Variot (Los Gatos, Calif.) and Hong Shen (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some aspects, the disclosed technology provides microelectronic devices which can effectively dissipate heat and methods of forming the disclosed microelectronic devices. In some embodiments, a disclosed device may include a first integrated device die. The disclosed device may further include a thermoelectr...