US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Feb. 3 for "Bonded structure with active interposer" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,577, issued on Feb. 3, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Bonded structure with active interposer" was invented by Belgacem Haba (Saratoga, Calif.) and Laura Wills Mirkarimi (Sunol, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can comprise a first semiconductor element having a first contact pad. An interposer can include a second contact pad on a first side of the interposer and a third contact pad and a fourth contact pad on a second side of the interposer opposite the first side, the second contact pad bonded to the first contact pad; a s...