US Patent Issued to Adeia Semiconductor Bonding Technologies on Feb. 10 for "Directly bonded metal structures having oxide layers therein" (California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,010, issued on Feb. 10, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Directly bonded metal structures having oxide layers therein" was invented by Oliver Zhao (Sunnyvale, Calif.), Bongsub Lee (Santa Clara, Calif.) and Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element, bonded structure that includes the element, and methods forming the same are disclosed. A bonded structure can include a first element having a first nonconductive field region and a first conductive feature, and a second element having a second nonconductive field region and a second conductive feature....