US Patent Issued to Adeia Semiconductor Bonding Technologies on Dec. 30 for "Integrated cooling assembly with upper and lower channels" (California, North Carolina Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,855, issued on Dec. 30, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Integrated cooling assembly with upper and lower channels" was invented by Belgacem Haba (Saratoga, Calif.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, an integrated cooling assembly includes a semiconductor device and a cold plate attached to a backside of the semiconductor device. The cold plate includes an upper portion disposed vertically adjacen...