US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Dec. 30 for "Expansion controlled structure for direct bonding and method of forming same" (California Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,425, issued on Dec. 30, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Expansion controlled structure for direct bonding and method of forming same" was invented by Cyprian Emeka Uzoh (San Jose, Calif.), Oliver Zhao (Sunnyvale, Calif.), Bongsub Lee (Santa Clara, Calif.), Laura Wills Mirkarimi (Sunol, Calif.) and Dominik Suwito (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element, a bonded structure including the element, and a method forming the element and the bonded structure are disclosed. The element can include a non-conductive region having a cavity. The element can include a conductiv...