US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Dec. 23 for "Directly bonded metal structures having aluminum features and methods of preparing same" (California Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,114, issued on Dec. 23, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Directly bonded metal structures having aluminum features and methods of preparing same" was invented by Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element, a bonded structure including the element, and a method of forming the same are disclosed. The bonded structure can include a first element having a first nonconductive field region and a first conductive feature. A surface of the first nonconductive field region and a surface of the first conductive feature at least partially defining a bonding su...