US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Aug. 5 for "Structures with through-substrate vias and methods for forming the same" (California, North Carolina Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,128, issued on Aug. 5, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Structures with through-substrate vias and methods for forming the same" was invented by Guilian Gao (San Jose, Calif.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic structure is disclosed. The microelectronic structure can include a bulk semiconductor portion that has a first surface and a second surface opposite the first surface. The microelectronic structure can include a via structure that extends at least partially through the bulk semiconductor portion along a direction n...