ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,119, issued on Aug. 5, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Seal for microelectronic assembly" was invented by Rajesh Katkar (San Jose, Calif.), Liang Wang (Milpitas, Calif.), Cyprian Emeka Uzoh (San Jose, Calif.), Shaowu Huang (Sunnyvale, Calif.), Guilian Gao (San Jose, Calif.) and Ilyas Mohammed (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wa...