US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Aug. 5 for "Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface" (North Carolina, California Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,173, issued on Aug. 5, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface" was invented by Gaius Gillman Fountain Jr. (Youngsville, N.C.), Chandrasekhar Mandalapu (Morrisville, N.C.), Cyprian Emeka Uzoh (San Jose, Calif.) and Jeremy Alfred Theil (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Representative implementations of techniques and methods include chemical mechanical polishing for hybrid bonding. The disclosed methods include depositing and patterning a die...