ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,168, issued on Aug. 5, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).
"Conductive barrier direct hybrid bonding" was invented by Paul M. Enquist (Cary, N.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a s...