US Patent Issued to Adeia Semiconductor Bonding Technologies on April 22 for "Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same" (North Carolina, California Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,490, issued on April 22, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same" was invented by Gaius Gillman Fountain Jr. (Youngsville, N.C.), Belgacem Haba (Saratoga, Calif.), George Carlton Hudson (Wendell, N.C.), Pawel Mrozek (San Jose, Calif.), Suhail Jaan Sadiq (Dublin, Calif.) and Laura Mirkarimi (Sunol, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a device package. The method comprises patterning a first substrate to form patterned regions comprising a thermal oxide layer. The method...