US Patent Issued to Additive Technologies on Oct. 7 for "Method for operating a metal drop ejecting three-dimensional (3D) object printer to form vias in printed circuit boards with conductive metal" (New York Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,525, issued on Oct. 7, was assigned to Additive Technologies LLC (Palm City, Fla.).

"Method for operating a metal drop ejecting three-dimensional (3D) object printer to form vias in printed circuit boards with conductive metal" was invented by Denis Cormier (Pittsford, N.Y.), Santokh S. Badesha (Pittsford, N.Y.) and Varun Sambhy (Pittsford, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identificatio...