ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,697, issued on Nov. 25, was assigned to ACM RESEARCH (SHANGHAI) INC. (Shanghai).
"Substrate supporting apparatus" was invented by Hui Wang (Shanghai), Feng Liu (Shanghai), Xiaofeng Tao (Shanghai), Shena Jia (Shanghai), Fuping Chen (Shanghai), Haibo Hu (Shanghai) and Yang Liu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a substrate supporting apparatus having a spin chuck and a plurality of locating pins. The spin chuck configured to support and rotate a substrate has a supporting surface. The locating pins are disposed at the periphery of the supporting surface for limiting the substrate horizontal displace...