ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,156, issued on Nov. 11, was assigned to ACM Research (Shanghai) Inc. (Shanghai).
"Plating apparatus and plating method" was invented by Yinuo Jin (Shanghai), Hongchao Yang (Shanghai), Jian Wang (Shanghai) and Hui Wang (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the ...