US Patent Issued to ACM Research (Shanghai) on Dec. 9 for "Apparatus and method for cleaning semiconductor wafers" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,360, issued on Dec. 9, was assigned to ACM Research (Shanghai) Inc. (Shanghai).

"Apparatus and method for cleaning semiconductor wafers" was invented by Hui Wang (Shanghai), Zhiyou Fang (Shanghai), Jun Wu (Shanghai), Guanzhong Lu (Shanghai), Fuping Chen (Shanghai), Jian Wang (Shanghai), Jun Wang (Shanghai) and Deyun Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for cleaning semiconductor wafers includes a plurality of load ports; at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning...