US Patent Issued to Acer on Sept. 16 for "Multi-loop cycling heat dissipation module" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,451, issued on Sept. 16, was assigned to Acer Inc. (New Taipei, Taiwan).

"Multi-loop cycling heat dissipation module" was invented by Yu-Ming Lin (New Taipei, Taiwan), Wen-Neng Liao (New Taipei, Taiwan), Cheng-Wen Hsieh (New Taipei, Taiwan), Chun-Chieh Wang (New Taipei, Taiwan), Tsung-Ting Chen (New Taipei, Taiwan), Chi-Tai Ho (New Taipei, Taiwan), Kuan-Lin Chen (New Taipei, Taiwan) and Jau-Han Ke (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a fir...