ALEXANDRIA, Va., Oct. 8 -- United States Patent no. D1,096,673, issued on Oct. 7, was assigned to Acer Inc. (New Taipei, Taiwan).
"Heat dissipation module" was invented by Wei-Yu Lai (New Taipei, Taiwan) and Yi-Heng Lee (New Taipei, Taiwan).
The patent was filed on Nov. 24, 2023, under Application No. D/918,034.
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