ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,270, issued on Aug. 26, was assigned to Acer Inc. (New Taipei, Taiwan).
"Thermal module" was invented by Jau-Han Ke (New Taipei, Taiwan), Tsung-Ting Chen (New Taipei, Taiwan), Chun-Chieh Wang (New Taipei, Taiwan), Yu-Ming Lin (New Taipei, Taiwan), Cheng-Wen Hsieh (New Taipei, Taiwan) and Wen-Neng Liao (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal module includes a fan and a fin assembly. The fan has an air outlet. The fin assembly has multiple fins, and is disposed to the air outlet of the fan. The fins are disposed side by side to form multiple flow channels. Each of the flow channels has a first inlet, at least one s...