ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,279, issued on Aug. 26, was assigned to Acer Inc. (New Taipei, Taiwan).
"Heat dissipation structure and electronic device" was invented by Kuang-Hua Lin (New Taipei, Taiwan), Wen-Neng Liao (New Taipei, Taiwan), Cheng-Wen Hsieh (New Taipei, Taiwan) and Tsung-Ting Chen (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a heat dissipation structure, including a conductive member disposed on and thermally coupled to a heat source, a heat pipe including evaporating and condensing parts, a fan disposed in correspondence to the condensing part, and a heat storage component disposed on a circuit board. The evaporating part is dis...