ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,968, issued on May 20, was assigned to ACCTON TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Cold plate module" was invented by Yu Ting Tseng (Chiayi County, Taiwan) and Jih-Che Yeh (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cold plate module includes a cold plate, a structural piece, a frame and an absorbing element. The cold plate includes a body, an inlet and an outlet. The body has a first and a second surfaces. The first surface abuts a heat source on a motherboard. The inlet and the outlet communicate with the body. The structural piece has a third and a fourth surfaces. The third surface connects the second surface. The struct...