US Patent Issued to Absolics on Oct. 28 for "Packaging substrate having element group in cavity unit and semiconductor device comprising the same" (South Korean, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,672, issued on Oct. 28, was assigned to Absolics Inc..

"Packaging substrate having element group in cavity unit and semiconductor device comprising the same" was invented by Sungjin Kim (Suwanee, Ga.), Youngho Rho (Daejeon, South Korea), Jincheol Kim (Hwaseong-si, South Korea) and Byungkyu Jang (Suwon-Si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment relates to a packaging substrate and a semiconductor device. The semiconductor device includes an element unit having a semiconductor element and a packaging substrate electrically connected to the element unit. A glass substrate is applied as a core of the packaging substrate...