US Patent Issued to Absolics on Oct. 28 for "Packaging substrate and semiconductor device comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,653, issued on Oct. 28, was assigned to Absolics Inc. (Covington, Ga.).

"Packaging substrate and semiconductor device comprising the same" was invented by Youngho Rho (Suwon-si, South Korea) and Jincheol Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a packaging substrate comprising a glass substrate comprising a first surface and a second surface which is the opposite surface of the first surface; a cavity unit forming a space inside the glass substrate; a cavity frame dividing the space into plural districts; and a cavity element comprised in at least some of the cavity unit, wherein the cavity frame compri...