US Patent Issued to Absolics on Dec. 23 for "Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method" (Georgia Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,040, issued on Dec. 23, was assigned to Absolics Inc. (Covington, Ga.).

"Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method" was invented by Sungjin Kim (Suwanee, Ga.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging substrate is provided. The packaging substrate includes a first area without a cavity and a second area with a cavity. The first area has first and second surfaces facing each other, and a cavity structure of the second area includes a cavity space; a contact surface; and a side wall. The contact surface is disposed opposite to the opening of the cavi...