US Patent Issued to ABSOLICS on April 29 for "Packaging substrate and semiconductor apparatus comprising same" (South Korean, American Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,742, issued on April 29, was assigned to ABSOLICS INC. (Covington, Ga.).

"Packaging substrate and semiconductor apparatus comprising same" was invented by Sungjin Kim (Suwanee, Ga.), Youngho Rho (Daejeon, South Korea), Jincheol Kim (Hwaseong-si, South Korea) and Byungkyu Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The embodiment relates to a packaging substrate and a semiconductor apparatus, including an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit; and it applies a glass substrate as a core of the packaging substrate, thereby can significantly impr...