ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,664, issued on Feb. 17, was assigned to AaltoSemi Inc. (Nanjing, China).
"Electronic package and fabricating method thereof" was invented by Min-Yao Chen (Nanjing, China), Yin-Ju Chen (Nanjing, China), Sung-Kun Lin (Nanjing, China) and Andrew C. Chang (Nanjing, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which a cover layer is embedded in a circuit structure to form a groove, and an electronic element is disposed on the cover layer in the groove. A cladding layer encapsulates the electronic element, and an external connection structure is disposed on the circuit structure and the cladding layer. Therefo...