ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,767, issued on Feb. 10, was assigned to AaltoSemi Inc. (Jiangsu, China).
"Package substrate and fabricating method thereof" was invented by Jiun-Hua Chiue (Suzhou, China), Yin-Ju Chen (Suzhou, China), Yi-Wen Liu (Suzhou, China), Min-Yao Chen (Suzhou, China) and Andrew C. Chang (Suzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate is provided, in which a thinner second dielectric layer is formed on one side of a circuit structure including a first dielectric layer, so as to prevent large stress difference between two opposite sides of the circuit structure, thereby preventing the package substrate from warpage problems. A ...