ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,796, issued on Feb. 10, was assigned to AaltoSemi Inc. (Jiangsu, China).
"Electronic package and fabricating method thereof" was invented by Yin-Ju Chen (Suzhou, China), Min-Yao Chen (Suzhou, China), Sung-Kun Lin (Suzhou, China) and Andrew C. Chang (Suzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electronic package, in which an external connection structure is formed on a first side of a circuit structure, at least one circuit assembly electrically connected to the circuit structure and at least one electronic element electrically connected to the circuit structure are disposed on a second side of the circuit structure, a...