ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,492, issued on Sept. 9, was assigned to AAC Technologies (Nanjing) Co. Ltd. (Nanjing, China).
"Preparation method of copper foam" was invented by Bo Zhang (Shenzhen, China) and Guochuang Huang (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A preparation method of copper foam includes coating copper paste on a release film to form a coating sheet with a thickness of 50-200 micro metre on the release film, peeling off the release film to obtain a copper foam preform after drying the release film with the coating sheet, and performing a glue discharging process on the copper foam preform and sintering the copper foam preform to obtain...