ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,018, issued on May 27, was assigned to AAC Microtech (Changzhou) Co. Ltd. (Changzhou, China).
"Cover plate and speaker module" was invented by Jingwei Yu (Changzhou, China), Qibo Li (Changzhou, China), Zhongfeng Gao (Changzhou, China) and Siyuan Ni (Changzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cover plate includes a substrate provided and a bridge structure. The bridge structure includes first and second ribs, and a bridge body. The first rib has first forming fillet formed at junction between the first rib and the substrate, and second forming fillet formed at junction between the first rib and the bridge body. The first and se...