ALEXANDRIA, Va., June 19 -- United States Patent no. 12,335,702, issued on June 17, was assigned to AAC Kaitai Technologies (Wuhan) Co. LTD (Wuhan, China).
"Method for manufacturing MEMS acoustic sensor" was invented by Qiang Dan (Wuhan, China), Chungmin Li (Taiwan, China), KianHeng Goh (Batu Pahat, Malaysia), Kahkeen Lai (Singapore) and Yang Li (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for manufacturing a MEMS acoustic sensor. A structural layer and a piezoelectric material layer are stacked on the substrate. Photolithography modeling is performed on the piezoelectric material layer and the structural layer. A polymer layer is stacked on the piezoelectric material lay...