US Patent Issued to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) on Oct. 21 for "Microphone circuit, microphone module, and method for raising sound pressure overload point of microphone" (Singaporean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,452,589, issued on Oct. 21, was assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) Co. LTD. (Shenzhen, China).

"Microphone circuit, microphone module, and method for raising sound pressure overload point of microphone" was invented by Dong Han (Singapore) and Chuationg Kee (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a microphone circuit, which includes an amplifier, a bias resistor and a bias network module. The first terminal of bias resistor connects to the preset bias voltage. The second end of the bias resistor connects the output end of the microphone. The bias network module is used to judge level of the voltage ...