US Patent Issued to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN), AAC Microtech (Changzhou) on May 27 for "Speaker module" (Chinese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,050, issued on May 27, was assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) Co. LTD. (Shenzhen, China) and AAC Microtech (Changzhou) Co. Ltd. (Changzhou, China).

"Speaker module" was invented by Haijuan Yang (Shenzhen, China), Lei Wang (Shenzhen, China) and Shuwen Wu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a speaker module. The speaker module includes a housing body, a vibration system, and a magnetic circuit system. The housing body includes a support frame having a through cavity, a front cover mounted on the through cavity opening side of the support frame, and a back cover mounted on the si...