US Patent Issued to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN), AAC Microtech (Changzhou) on Jan. 20 for "Speaker module and assembling method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,120, issued on Jan. 20, was assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) Co. LTD. (Guangdong, China) and AAC Microtech (Changzhou) Co. Ltd. (Jiangsu, China).

"Speaker module and assembling method thereof" was invented by Haijuan Yang (Shenzhen, China), Lei Wang (Shenzhen, China) and Shuwen Wu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A speaker module and an assembling method of the speaker module includes a housing, a vibration system, and a magnetic circuit system. An accommodation space is defined in the housing, and the vibration system and the magnetic circuit system are accommodated in the accommodation space. The hous...