US Patent Issued to 3M Innovative Properties on Sept. 9 for "Patterned design for thermal management of two-phase immersion cooling system for electronics" (Singaporean, American Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,807, issued on Sept. 9, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).

"Patterned design for thermal management of two-phase immersion cooling system for electronics" was invented by Ravi Palaniswamy (Singapore), Sung W. Moon (Woodbury, Minn.), Brinda B. Badri (Woodbury, Minn.) and Siang Sin Foo (Serangoon, Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of feature...