ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,106, issued on Nov. 4, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).
"Electric assembly including heat spreading layer" was invented by Jiwoong Kong (Hwaseong-si, South Korea) and Jung Ju Suh (Seocho-gu, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment of the present invention, an electronic assembly comprises: a circuit board including a plurality of connection parts having electrical conductivity; a plurality of spaced apart semiconductor integrated circuits mounted on the circuit board and electrically connected to the plurality of connection parts; a protective layer disposed on the plurality...