ALEXANDRIA, Va., March 5 -- United States Patent no. 12,241,006, issued on March 4, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).

"High density post arrays" was invented by Sara Hemmer Frisco (Blaine, Minn.) and Guy M. Kallman (Woodbury, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film-based article including a film layer having first and second major sides, an adhesive layer comprising a first surface adjacent to the second major side of the film and a second surface opposite the first surface, wherein the second surface of the adhesive layer comprises a structured surface comprising a plurality of outwardly extending protrusions, each having a base, wherein the bases of the plu...