ALEXANDRIA, Va., March 5 -- United States Patent no. 12,245,411, issued on March 4, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).
"Circuit board to which 3D formed electromagnetic shielding film is attached, 3D formable electromagnetic shielding film, and 3D formed electromagnetic shielding film" was invented by Chao Yang (Shanghai), Yuan Zhao (Shanghai), Zhiyong Xu (Shanghai) and Ju Le Sun (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagneti...