US Patent Issued to 3M Innovative Properties on Feb. 25 for "Circuits including micropatterns and using partial curing to adhere dies" (Minnesota, California Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,292, issued on Feb. 25, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).

"Circuits including micropatterns and using partial curing to adhere dies" was invented by Teresa M. Goeddel (St. Paul, Minn.), Ankit Mahajan (Cupertino, Calif.), Mikhail L. Pekurovsky (Bloomington, Minn.), Saagar A. Shah (Minneapolis), Kara A. Meyers (Oakdale, Minn.) and Christopher G. Walker (Edina, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method comprises: providing a layer of curable adhesive material (4) on a substrate (2); forming a pattern of microstructures (321) on the layer of curable adhesive material (4); curing a first region (42) of th...