US Patent Issued on Sept. 23 for "System and methods for managing heat in a photonic integrated circuit" (Massachusetts Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,397, issued on Sept. 23.

"System and methods for managing heat in a photonic integrated circuit" was invented by John Heanue (Manchester, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm."

The patent was filed on Jan. 20, 2023, under Application No. 18/099,...