ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,541, issued on Sept. 23.
"Mold and gas sensor sealing method using mold" was invented by Wen-Lo Hsieh (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a gas sensor sealing method, including: providing a substrate, where a soldered dot is formed on an upper surface of the substrate; providing a sensing chip, where the sensing chip is arranged on the upper surface of the substrate, and electrically connected to the soldered dot; providing a cover body in which a protective film is embedded, to bond a top surface of the protective film with a lower surface of the cover body, where the cover body includes at least one thro...