US Patent Issued on Oct. 7 for "Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,248, issued on Oct. 7.

"Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package" was invented by Takahiro Kuroda (Tokyo), Naoki Tomori (Tokyo) and Tomohiro Nagoya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temporary protective film for semiconductor encapsulation molding includes a support film and an adhesive layer. The adhesive layer contains a thermoplastic resin and at least one compound selected from the group consisting of sorbitol polyglycidyl ether, polyethylene glycol diglycidyl ether, a gl...