US Patent Issued on Oct. 7 for "Method for improving the uniformity of rare earth nickelate thin films deposited by reactive magnetron sputtering" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,408, issued on Oct. 7.

"Method for improving the uniformity of rare earth nickelate thin films deposited by reactive magnetron sputtering" was invented by Zhen Zhang (Xi'an, China), Xurong Qiao (Xi'an, China) and Jiahui Sun (Xi'an, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to the technical field of magnetron sputtering process, and specifically to a method for improving the uniformity of rare earth nickelate thin film deposited by reactive magnetron sputtering, comprising the following steps: adjusting the sputter angle of a Ni target toward a substrate to perform magnetron sputtering to deposit a thin film, a...