US Patent Issued on Oct. 7 for "Dot bonding shoe insole using adhesive resin mixed with hydrophobic nano-silica and manufacturing thereof" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,433,369, issued on Oct. 7.

"Dot bonding shoe insole using adhesive resin mixed with hydrophobic nano-silica and manufacturing thereof" was invented by Heedae Park (Busan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed ...