US Patent Issued on Oct. 28 for "Interconnect device and semiconductor assembly incorporating the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,689, issued on Oct. 28.

"Interconnect device and semiconductor assembly incorporating the same" was invented by GunHyuck Lee (Incheon, South Korea) and SangHyun Son (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect device comprises an insulating frame. The insulating frame comprises: a top insulating layer formed uppermost of the insulating frame and occupying an entirety of a top surface of the insulating frame; a bottom insulating layer formed lowermost of the insulating frame and occupying an entirety of a bottom surface of the insulating frame; and a central insulating layer that includes a plurality of insulator...