US Patent Issued on Oct. 21 for "Platform supporting direct electrical connections between two OSFP transceivers" (California Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,452,997, issued on Oct. 21.

"Platform supporting direct electrical connections between two OSFP transceivers" was invented by Shuang Jin (Dublin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Two OSFP transceivers' connectors' footprints are placed on the opposite sides of a PCB board. The two footprints are aligned in a special way and the connections among the high speed signals' pads of the two footprints are specially defined. Based on that, the high speed signals' pads of the two footprints are connected through PCB traces and vias. Two OSFP electrical connectors are soldered onto the two footprints. So the electrical high-speed signals com...