US Patent Issued on Oct. 21 for "Mitigating thermal impacts on adjacent stacked semiconductor devices" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,464, issued on Oct. 21.

"Mitigating thermal impacts on adjacent stacked semiconductor devices" was invented by Sui Chi Huang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly and associated methods are disclosed herein. The semiconductor device assembly includes (1) a substrate having a first side and a second side opposite the first side; (2) a first set of stacked semiconductor devices at the first side of the substrate; (3) a second set of stacked semiconductor devices adjacent to one side of the first set of stacked semiconductor devices; (4) a third set of stacked semiconductor devices adjacent to ...